Free Training Program Announcement: Semiconductor Packaging Technology Course (June 22 – July 1)

Are you interested in understanding how the semiconductor industry works? Do you want to explore careers in the high-tech sector and gain early insight into engineers’ job roles and future career pathways?

This training program provides students with a foundational understanding of semiconductor packaging technology and its industrial applications. Through corporate lectures and company visits, participants will gain insights into the semiconductor industry chain in the Southern Taiwan Science Park (STSP) and understand industry talent requirements.

Course Highlights

• Fully funded (free of charge)

• Lectures delivered by engineers from leading semiconductor companies

• Company visits to semiconductor enterprises

• Corporate recruitment information sessions

• Certificate of completion

• Early exposure to the technology industry and career development pathways

Participating Companies

ASE Group, SPIL (Siliconware Precision Industries Co., Ltd.), EBARA Taiwan, and other semiconductor-related enterprises

Course Schedule

June 22, 2026 (Monday) – July 1, 2026 (Wednesday)
Total: 8 days / 33 hours

Location

National Chung Cheng University

Eligibility

• Students from science and engineering programs at universities and colleges nationwide

• Priority given to senior undergraduate students and master’s students

• Students interested in the semiconductor industry are welcome to apply

Registration

Application form:
https://forms.gle/nYBbhYnZFRkNBHMn7

Selection is based on review due to limited spots. Interested students are encouraged to apply early.

Contact Information

Office of Research and Development & Career Service Center
Ms. Tsai
Tel: +886-5-5342601 ext. 2541